Systems and methods for additive manufacturing

ABSTRACT

A method of fabricating a component is provided. The method includes depositing particles onto a build platform. The method also includes distributing the particles to form a build layer. The method further includes operating a consolidation device to consolidate a first plurality of particles along a scan path to form a component. The component includes a top surface spaced apart from the build platform and an outer surface. The outer surface extends between the build platform and the top surface, and at least a portion of the outer surface faces a substantially particle-free region of the build platform.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation application of U.S. application Ser.No. 16/007,272 filed Jun. 13, 2018, titled “SYSTEMS AND METHODS FORADDITIVE MANUFACTURING,” herein incorporated by reference.

BACKGROUND

The subject matter described herein relates generally to additivemanufacturing systems and, more particularly, to additive manufacturingsystems for forming components at least partially surrounded by aparticulate-free region.

At least some additive manufacturing systems involve the consolidationof a particulate material to fabricate a component. Such techniquesfacilitate producing complex components from expensive materials at areduced cost and with improved manufacturing efficiency. At least someknown additive manufacturing systems, such as Direct Metal Laser Melting(DMLM), Selective Laser Melting (SLM), Direct Metal Laser Sintering(DMLS), and LaserCusing® systems, fabricate components using a focusedenergy source, such as a laser device or an electron beam generator, abuild platform, and a particulate bed containing a particulate, such as,without limitation, a powdered metal. (LaserCusing is a registeredtrademark of Concept Laser GmbH of Lichtenfels, Germany.) In at leastsome DMLM systems, a recoat device is used to recoat the component withparticulate material after each build layer is scanned by the laserbeam. However, in at least some known systems, the volume of particulatematerial required to ensure complete and consistent recoating of thecomponent in a one-size-fits-all particulate bed can be quite large andmay result in substantial particulate material waste at a substantialcost to the operator of the additive manufacturing system.

BRIEF DESCRIPTION

In one aspect, a method of fabricating a component is provided. Themethod includes depositing particles onto a build platform. The methodalso includes distributing the particles to form a build layer. Themethod further includes operating a consolidation device to consolidatea first plurality of particles along a scan path to form a component.The component includes a top surface spaced apart from the buildplatform and an outer surface. The outer surface extends between thebuild platform and the top surface, and at least a portion of the outersurface faces a substantially particle-free region of the buildplatform.

In another aspect, an additive manufacturing system is provided. Theadditive manufacturing system includes at least one consolidation deviceconfigured to direct at least one energy beam to generate a melt pool ina build layer of particles, a build platform, and a component formed onthe build platform. The component includes a first plurality ofparticles consolidated together including a top surface spaced apartfrom the build platform and an outer surface. The outer surface extendsbetween the build platform and the top surface, and at least a portionof the outer surface faces a substantially particle-free region of thebuild platform.

In yet another aspect, a controller for use in an additive manufacturingsystem is provided. The additive manufacturing system includes at leastone consolidation device configured to consolidate at least a portion ofa plurality of particles on a build platform. The controller includes aprocessing device and a memory device coupled to the processing device.The controller is configured to receive a build file, the build filedefining a plurality of scan paths for a plurality of build layers for acomponent. The controller is also configured to control theconsolidation device, based on the build file, to consolidate a firstplurality of particles along a scan path of the plurality of scan pathsto form at least a portion of the component. The component includes atop surface spaced apart from the build platform and an outer surface.The outer surface extends between the build platform and the topsurface, and at least a portion of the outer surface faces asubstantially particle-free region of the build platform.

DRAWINGS

These and other features, aspects, and advantages of the presentdisclosure will become better understood when the following detaileddescription is read with reference to the accompanying drawings in whichlike characters represent like parts throughout the drawings, wherein:

FIG. 1 is a schematic view of an exemplary additive manufacturingsystem;

FIG. 2 is a block diagram of a controller that may be used to operatethe additive manufacturing system shown in FIG. 1;

FIG. 3 is a section schematic view of a portion of an exemplarycomponent illustrating an exemplary energy beam and an exemplaryconsolidation device that may be used to fabricate the component;

FIG. 4 is a plan schematic view of the component shown in FIG. 3;

FIG. 5 is a section side schematic view of the component shown in FIG.4;

FIG. 6 is an enlarged schematic view of region 4 shown in FIG. 5illustrating an exemplary build layer retainer that may be used with thecomponent shown in FIG. 4;

FIG. 7 is a plan schematic view of an alternative embodiment of thecomponent shown in FIG. 4;

FIG. 8 is a section side schematic view of the component shown in FIG.7; and

FIG. 9 is a flowchart of an exemplary method that may be used tofabricate the component shown in FIG. 4.

Unless otherwise indicated, the drawings provided herein are meant toillustrate features of embodiments of the disclosure. These features arebelieved to be applicable in a wide variety of systems comprising one ormore embodiments of the disclosure. As such, the drawings are not meantto include all conventional features known by those of ordinary skill inthe art to be required for the practice of the embodiments disclosedherein.

DETAILED DESCRIPTION

In the following specification and the claims, reference will be made toa number of terms, which shall be defined to have the followingmeanings.

The singular forms “a”, “an”, and “the” include plural references unlessthe context clearly dictates otherwise.

“Optional” or “optionally” means that the subsequently described eventor circumstance may or may not occur, and that the description includesinstances where the event occurs and instances where it does not.

Approximating language, as used herein throughout the specification andclaims, may be applied to modify any quantitative representation thatcould permissibly vary without resulting in a change in the basicfunction to which it is related. Accordingly, a value modified by a termor terms, such as “about,” “substantially,” and “approximately,” are notto be limited to the precise value specified. In at least someinstances, the approximating language may correspond to the precision ofan instrument for measuring the value. Here and throughout thespecification and claims, range limitations may be combined and/orinterchanged, such ranges are identified and include all the sub-rangescontained therein unless context or language indicates otherwise.

As used herein, the terms “processor” and “computer,” and related terms,e.g., “processing device,” “computing device,” and “controller” are notlimited to just those integrated circuits referred to in the art as acomputer, but broadly refers to a microcontroller, a microcomputer, aprogrammable logic controller (PLC), and application specific integratedcircuit, and other programmable circuits, and these terms are usedinterchangeably herein. In the embodiments described herein, memory mayinclude, but it not limited to, a computer-readable medium, such as arandom access memory (RAM), a computer-readable non-volatile medium,such as a flash memory. Alternatively, a floppy disk, a compactdisc-read only memory (CD-ROM), a magneto-optical disk (MOD), and/or adigital versatile disc (DVD) may also be used. Also, in the embodimentsdescribed herein, additional input channels may be, but are not limitedto, computer peripherals associated with an operator interface such as amouse and a keyboard. Alternatively, other computer peripherals may alsobe used that may include, for example, but not be limited to, a scanner.Furthermore, in the exemplary embodiment, additional output channels mayinclude, but not be limited to, an operator interface monitor.

Further, as used herein, the terms “software” and “firmware” areinterchangeable, and include any computer program storage in memory forexecution by personal computers, workstations, clients, and servers.

As used herein, the term “non-transitory computer-readable media” isintended to be representative of any tangible computer-based deviceimplemented in any method of technology for short-term and long-termstorage of information, such as, computer-readable instructions, datastructures, program modules and sub-modules, or other data in anydevice. Therefore, the methods described herein may be encoded asexecutable instructions embodied in a tangible, non-transitory,computer-readable medium, including, without limitation, a storagedevice and/or a memory device. Such instructions, when executed by aprocessor, cause the processor to perform at least a portion of themethods described herein. Moreover, as used herein, the term“non-transitory computer-readable media” includes all tangible,computer-readable media, including, without limitation, non-transitorycomputer storage devices, including without limitation, volatile andnon-volatile media, and removable and non-removable media such asfirmware, physical and virtual storage, CD-ROMS, DVDs, and any otherdigital source such as a network or the Internet, as well as yet to bedeveloped digital means, with the sole exception being transitory,propagating signal.

Furthermore, as used herein, the term “real-time” refers to at least oneof the time of occurrence of the associated events, the time ofmeasurement and collection of predetermined data, the time to processthe data, and the time of a system response to the events and theenvironment. In the embodiments described herein, these activities andevents occur substantially instantaneously.

As used herein, the term “substantially particle-free region” refers toany non-constrained portion of a build platform wherein the number ofparticles deposited thereon is insubstantial enough that it is notintended to be used in a build process of an additive manufacturingsystem. In other words, a substantially particle-free region of a buildplatform may contain any quantity of particles resulting from spill-overof particles from within an additively manufactured structure and notconstrained by a portion of the additive manufacturing system. However,a substantially particle-free region does not contain a sufficientquantity of particles such that the particles are intended to be used inthe build process of an additive manufacturing system. Specifically, asubstantially particle-free region may not contain a quantity ofparticles intended to be consolidated by a consolidation device to forma component in an additive manufacturing system.

The systems and methods described herein include an additivemanufacturing system including at least one consolidation deviceconfigured to direct at least one energy beam to generate a melt pool ina layer of particles, a build platform, and a component formed on thebuild platform. The component includes a top surface spaced apart fromthe build platform and an outer surface. The outer surface extendsbetween the build platform and the top surface, and at least a portionof the outer surface faces a substantially particle-free region of thebuild platform. In some embodiments, a build layer retainer isconfigured to retain at least a portion of the build layer along the topsurface of the component. The additive manufacturing system and theconfiguration of the component facilitates improving additivelymanufacturing components without surrounding an outer face of thecomponent with particles to facilitate improving the quality of anadditively manufacturing component and reducing the cost to additivelymanufacture the component.

Additive manufacturing processes and systems include, for example, andwithout limitation, vat photopolymerization, powder bed fusion, binderjetting, material jetting, sheet lamination, material extrusion,directed energy deposition and hybrid systems. These processes andsystems include, for example, and without limitation,SLA—Stereolithography Apparatus, DLP—Digital Light Processing, 3SP—Scan,Spin, and Selectively Photocure, CLIP—Continuous Liquid InterfaceProduction, SLS—Selective Laser Sintering, DMLS—Direct Metal LaserSintering, SLM—Selective Laser Melting, EBM—Electron Beam Melting,SHS—Selective Heat Sintering, MJF—Multi-Jet Fusion, 3D Printing,Voxeljet, Polyjet, SCP Smooth Curvatures Printing, MJM—Multi-JetModeling Projet, LOM—Laminated Object Manufacture, SDL—SelectiveDeposition Lamination, UAM—Ultrasonic Additive Manufacturing, FFF—FusedFilament Fabrication, FDM—Fused Deposition Modeling, LMD—Laser MetalDeposition, LENS—Laser Engineered Net Shaping, DMD—Direct MetalDeposition, Hybrid Systems, and combinations of these processes andsystems. These processes and systems may employ, for example, andwithout limitation, all forms of electromagnetic radiation, heating,sintering, melting, curing, binding, consolidating, pressing, embedding,and combinations thereof.

Additive manufacturing processes and systems employ materials including,for example, and without limitation, polymers, plastics, metals,ceramics, sand, glass, waxes, fibers, biological matter, composites, andhybrids of these materials. These materials may be used in theseprocesses and systems in a variety of forms as appropriate for a givenmaterial and the process or system, including, for example, and withoutlimitation, as liquids, solids, powders, sheets, foils, tapes,filaments, pellets, liquids, slurries, wires, atomized, pastes, andcombinations of these forms.

FIG. 1 is a schematic view of an exemplary additive manufacturing system10. A coordinate system 12 includes an X-axis, a Y-axis, and a Z-axis.In the exemplary embodiment, additive manufacturing system 10 includes aconsolidation device 14 including a laser device 16, a scanning motor18, a scanning mirror 20, and a scanning lens 22 for fabricating acomponent 24 using a layer-by-layer manufacturing process.Alternatively, consolidation device 14 may include any component thatfacilitates consolidation of a material using any of the processes andsystems described herein. Laser device 16 provides a high-intensity heatsource configured to generate a melt pool 26 (not shown to scale) in apowdered material using an energy beam 28. Laser device 16 is containedwithin a housing 30 that is coupled to a mounting system 32. Inalternative embodiments, consolidation device 14 may include any numberof laser devices 16 coupled to a mounting system in any configurationthat facilitates operation of additive manufacturing system 10 asdescribed herein. Additive manufacturing system 10 also includes acomputer control system, or controller 34.

Mounting system 32 is moved by an actuator or an actuator system 36 thatis configured to move mounting system 32 in the X-direction, theY-direction, and the Z-direction to cooperate with scanning mirror 20 tofacilitate fabricating a layer of component 24 within additivemanufacturing system 10. For example, and without limitation, mountingsystem 32 is pivoted about a central point, moved in a linear path, acurved path, and/or rotated to cover a portion of the powder on a buildplatform 38 to facilitate directing energy beam 28 along the surface ofa plurality of particles 45 of a build layer 44 to form a layer ofcomponent 24. Alternatively, at least one of housing 30, energy beam 28,and build platform 38 is moved in any orientation and manner thatenables additive manufacturing system 10 to function as describedherein.

Scanning motor 18 is controlled by controller 34 and is configured tomove mirror 20 such that energy beam 28 is reflected to be incidentalong a predetermined path along build platform 38, such as, forexample, and without limitation, a linear and/or rotational scan path40. In the exemplary embodiment, the combination of scanning motor 18and scanning mirror 20 forms a two-dimension scan galvanometer.Alternatively, scanning motor 18 and scanning mirror 20 may include athree-dimension (3D) scan galvanometer, dynamic focusing galvanometer,and/or any other method that may be used to deflect energy beam 28 oflaser device 16.

In the exemplary embodiment, build platform 38 defines a build platformplane 39 and is mounted to a support structure 42, which is moved byactuator system 36. As described above with respect to mounting system32, actuator system 36 is also configured to move support structure 42in a Z-direction (i.e., normal to a top surface of build platform 38).In some embodiments, actuator system 36 is also configured to movesupport structure 42 in the XY plane. For example, and withoutlimitation, in an alternative embodiment where housing 30 is stationary,actuator system 36 moves support structure 42 in the XY plane tocooperate with scanning motor 18 and scanning mirror 20 to direct energybeam 28 of laser device 16 along scan path 40 about build platform 38.In the exemplary embodiment, actuator system 36 includes, for example,and without limitation, a linear motor(s), a hydraulic and/or pneumaticpiston(s), a screw drive mechanism(s), and/or a conveyor system.

In the exemplary embodiment, additive manufacturing system 10 isoperated to fabricate component 24 from a computer modeledrepresentation of the 3D geometry of component 24. The computer modeledrepresentation may be produced in a computer aided design (CAD) orsimilar file. The CAD file of component 24 is converted into alayer-by-layer format that includes a plurality of build parameters foreach layer of component 24, for example, a build layer 44 of component24 including a plurality of particles 45 to be consolidated by additivemanufacturing system 10. In the exemplary embodiment, component 24 ismodeled in a desired orientation relative to the origin of thecoordinate system used in additive manufacturing system 10. The geometryof component 24 is sliced into a stack of layers of a desired thickness,such that the geometry of each layer is an outline of the cross-sectionthrough component 24 at that particular layer location. Scan paths 40are generated across the geometry of a respective layer. The buildparameters are applied along scan path 40 to fabricate that layer ofcomponent 24 from particles 45 used to construct component 24. The stepsare repeated for each respective layer of component 24 geometry. Oncethe process is completed, an electronic computer build file (or files)is generated, including all of the layers. The build file is loaded intocontroller 34 of additive manufacturing system 10 to control the systemduring fabrication of each layer.

After the build file is loaded into controller 34, additivemanufacturing system 10 is operated to generate component 24 byimplementing the layer-by-layer manufacturing process, such as a directmetal laser melting method. The exemplary layer-by-layer additivemanufacturing process does not use a pre-existing article as theprecursor to the final component, rather the process produces component24 from a raw material in a configurable form, such as particles 45. Forexample, and without limitation, a steel component can be additivelymanufactured using a steel powder. Additive manufacturing system 10enables fabrication of components, such as component 24, using a broadrange of materials, for example, and without limitation, metals,ceramics, glass, and polymers.

FIG. 2 is a block diagram of controller 34 that may be used to operateadditive manufacturing system 10 (shown in FIG. 1). In the exemplaryembodiment, controller 34 is any type of controller typically providedby a manufacturer of additive manufacturing system 10 to controloperation of additive manufacturing system 10. Controller 34 executesoperations to control the operation of additive manufacturing system 10based at least partially on instructions from human operators.Controller 34 includes, for example, a 3D model of component 24 to befabricated by additive manufacturing system 10. Operations executed bycontroller 34 include controlling power output of laser device 16 (shownin FIG. 1) and adjusting mounting system 32 and/or support structure 42,via actuator system 36 (all shown in FIG. 1) to control the scanningvelocity of energy beam 28. Controller 34 is also configured to controlscanning motor 18 to direct scanning mirror 20 to further control thescanning velocity of energy beam 28 within additive manufacturing system10. In alternative embodiments, controller 34 may execute any operationthat enables additive manufacturing system 10 to function as describedherein.

In the exemplary embodiment, controller 34 includes a memory device 48and a processor 50 coupled to memory device 48. Processor 50 may includeone or more processing units, such as, without limitation, a multi-coreconfiguration. Processor 50 is any type of processor that permitscontroller 34 to operate as described herein. In some embodiments,executable instructions are stored in memory device 48. Controller 34 isconfigurable to perform one or more operations described herein byprogramming processor 50. For example, processor 50 may be programmed byencoding an operation as one or more executable instructions andproviding the executable instructions in memory device 48. In theexemplary embodiment, memory device 48 is one or more devices thatenable storage and retrieval of information such as executableinstructions or other data. Memory device 48 may include one or morecomputer readable media, such as, without limitation, random accessmemory (RAM), dynamic RAM, static RAM, a solid-state disk, a hard disk,read-only memory (ROM), erasable programmable ROM, electrically erasableprogrammable ROM, or non-volatile RAM memory. The above memory types areexemplary only, and are thus not limiting as to the types of memoryusable for storage of a computer program.

Memory device 48 may be configured to store any type of data, including,without limitation, build parameters associated with component 24. Insome embodiments, processor 50 removes or “purges” data from memorydevice 48 based on the age of the data. For example, processor 50 mayoverwrite previously recorded and stored data associated with asubsequent time or event. In addition, or alternatively, processor 50may remove data that exceeds a predetermined time interval. In addition,memory device 48 includes, without limitation, sufficient data,algorithms, and commands to facilitate monitoring of build parametersand the geometric conditions of component 24 being fabricated byadditive manufacturing system 10.

In some embodiments, controller 34 includes a presentation interface 52coupled to processor 50. Presentation interface 52 presents information,such as the operating conditions of additive manufacturing system 10, toa user 54. In one embodiment, presentation interface 52 includes adisplay adapter (not shown) coupled to a display device (not shown),such as a cathode ray tube (CRT), a liquid crystal display (LCD), anorganic LED (OLED) display, or an “electronic ink” display. In someembodiments, presentation interface 52 includes one or more displaydevices. In addition, or alternatively, presentation interface 52includes an audio output device (not shown), for example, withoutlimitation, an audio adapter or a speaker (not shown).

In some embodiments, controller 34 includes a user input interface 56.In the exemplary embodiment, user input interface 56 is coupled toprocessor 50 and receives input from user 54. User input interface 56may include, for example, without limitation, a keyboard, a pointingdevice, a mouse, a stylus, a touch sensitive panel, such as, withoutlimitation, a touch pad or a touch screen, and/or an audio inputinterface, such as, without limitation, a microphone. A singlecomponent, such as a touch screen, may function as both a display deviceof presentation interface 52 and user input interface 56.

In the exemplary embodiment, a communication interface 58 is coupled toprocessor 50 and is configured to be coupled in communication with oneor more other devices, such as laser device 16, and to perform input andoutput operations with respect to such devices while performing as aninput channel. For example, communication interface 58 may include,without limitation, a wired network adapter, a wireless network adapter,a mobile telecommunications adapter, a serial communication adapter, ora parallel communication adapter. Communication interface 58 may receivea data signal from or transmit a data signal to one or more remotedevices. For example, in some embodiments, communication interface 58 ofcontroller 34 may transmit/receive a data signal to/from actuator system36.

Presentation interface 52 and communication interface 58 are bothcapable of providing information suitable for use with the methodsdescribed herein, such as, providing information to user 54 or processor50. Accordingly, presentation interface 52 and communication interface58 may be referred to as output devices. Similarly, user input interface56 and communication interface 58 are capable of receiving informationsuitable for use with the methods described herein and may be referredto as input devices.

FIG. 3 is a section schematic view of a portion of component 24 (shownin FIG. 1) illustrating energy beam 28 and consolidation device 14during fabrication of a build layer retainer 100 positioned along a topsurface 102 of component 24 and facing a substantially particle-freeregion 103. With reference to FIGS. 1-3, in the exemplary embodiment,controller 34 controls consolidation device 14, based on a build file toconsolidate a first plurality 104 of particles 45 along scan path 40 toform at least a portion of component 24. In the exemplary embodiment,consolidation device 14 includes laser device 16 that is configured toemit an energy beam 28. Controller 34 is configured to direct energybeam 28 to be incident on first plurality 104 of particles 45 along scanpath 40 at a consolidation angle 60 of between zero degrees and ninetydegrees, relative to build platform plane 39. In the exemplaryembodiment, consolidation angle 60 is maintained between seventy-fivedegrees and ninety degrees during fabrication of component 24 tofacilitate fabricating component 24, including build layer retainer 100,by using melt pool surface tension effects to reduce the effects ofparticle 45 starvation at a radially outer portion of top surface 102and an outer surface 106 during formation of component 24.

In the exemplary embodiment, controller 34 may control consolidationdevice 14 to direct energy beam 28 to be incident on outer surface 106at any angle relative to build platform plane 39 to facilitategenerating a desired surface finish of outer surface 106. In theexemplary embodiment, consolidation device 14 is illustrated as beingpositioned to direct energy beam 28 to be incident on component 24 froma position overlying substantially particle-free region 103. In analternative embodiment, consolidation device 14 may be positioned todirect energy beam 28 to be incident on component 24 from a positionoverlying component 24. In another alternative embodiment, consolidationdevice 14 may be controlled to direct energy beam 28 to consolidate anyportion of component 24 that facilitates fabrication of component 24using additive manufacturing system 10 as described herein.

FIG. 4 is a plan schematic view of component 24. FIG. 5 is a sectionside schematic view of component 24 taken along line 3-3 (shown in FIG.4). FIG. 6 is an enlarged schematic view of region 4 (shown in FIG. 5)illustrating build layer retainer 100 that may be used with component 24(shown in FIG. 4). In the exemplary embodiment, component 24 andadditive manufacturing system 10 are configured to facilitate reducingthe quantity of particles 45 required for operation of additivemanufacturing system 10 and to facilitate improving the quality ofcomponent 24. In the exemplary embodiment, additive manufacturing system10 includes component 24 positioned on build platform 38, four componentsupports 108, and four particle containment walls 110. In an alternativeembodiment, additive manufacturing system 10 may not include at leastone of build layer retainer 100, component supports 108 and particlecontainment walls 110. In the exemplary embodiment, at least a portionof component 24, build layer retainer 100, and particle containmentwalls 110 are generally circular. In alternative embodiments, component24, build layer retainer 100, component supports 108, and particlecontainment wall 110 may be any shape and be present in any quantitythat facilitates fabrication of component 24 as described herein. Theconfiguration and arrangement of additive manufacturing system 10 ismerely an example, and those of skill in the art will appreciate thatadditive manufacturing system 10 may have any configuration that enablesadditive manufacturing system 10 to function as described herein.

In the exemplary embodiment, component 24 is substantially solid and isfabricated from first plurality 104 of particles 45 consolidatedtogether using a consolidation process using a consolidation device,such as consolidation device 14. More specifically, component 24includes top surface 102 spaced apart from build platform 38, outersurface 106, and build layer retainer 100. In the exemplary embodiment,component 24 extends along the Z-direction between build platform 38 andtop surface 102 by a component height 112. Top surface 102 defines a topsurface plane 114. In the exemplary embodiment, component 24 includesfour lobes 116 extending from a center portion 118, and extends in an XYplane by an outer diameter 120. Outer surface 106 defines an outerprofile 122 including a lobe end radius 124 defining a radiallyoutermost profile 126 of each lobe 116. In alternative embodiments,component 24 may have any configuration and have any shape thatfacilitates fabrication of component 24 as described herein.

In the exemplary embodiment, particle containment walls 110 aresubstantially solid and are fabricated from a second plurality 200 ofparticles 45 consolidated together using a consolidation device, such asconsolidation device 14. Particle containment walls 110 are coupled toouter surface 106 and are configured to retain a plurality of particles45 between particle containment walls 110 and at least a portion ofouter surface 106, defining particle retention cavities 202. Morespecifically, each particle containment wall 110 extends along theZ-direction from build platform 38 by a wall height 204 and extendsbetween adjacent lobes 116 of component 24, defining a wall radius 206substantially similar to lobe end radius 124. In the exemplaryembodiment, particle containment walls 110 have a wall thickness 208 andare continuous with radially outermost profile 126 of each lobe 116. Inalternative embodiments, particle containment walls 110 may becontinuous with at least a portion of component 24. In furtheralternative embodiments, particle containment walls 110 may extendbetween any portion of component 24 and have any configuration thatfacilitates fabrication of component 24 by additive manufacturing system10 as described herein.

In the exemplary embodiment, component supports 108 are substantiallysolid and are fabricated from a third plurality 300 of particles 45consolidated together using a consolidation device, such asconsolidation device 14. In the exemplary embodiment, component supports108 extend from build platform 38 along the Z direction by a supportheight (not labeled in figures). Each component support 108 is coupledto component 24 and a particle containment wall 110 and is configured tosupport at least a portion of component 24 during the manufacturingprocess. In the exemplary embodiment, component supports 108 arepositioned within particle retention cavities 202, have a rectangularcross-sectional area, and extend along the Z-direction from buildplatform 38 to top surface plane 114. In alternative embodiments,component supports 108 may extend along any direction by any supportheight and may be coupled to any portion of component 24 thatfacilitates fabrication of component 24 as described herein.

In the exemplary embodiment, build layer retainer 100 is configured toretain a plurality of particles 45 along top surface 102, issubstantially solid, and is fabricated from a plurality of particles 45consolidated together using a consolidation process using aconsolidation device, such as consolidation device 14, as describedherein. More specifically, build layer retainer 100 extends from topsurface 102 along the Z-direction substantially orthogonal to topsurface plane 114 by a retainer height 101 and facilitates retaining atleast a portion of build layer 44 overlying top surface 102 tofacilitate improving the formation of component 24. In the exemplaryembodiment, build layer retainer 100 extends from a radially outerportion of component 24 along outer profile 122 at a retainer angle 128of approximately ninety degrees relative to top surface plane 114. Inalternative embodiments, build layer retainer 100 may extend fromcomponent 24 at any angle between approximately ninety degrees andforty-five degrees relative to top surface plane 114. In anotheralternative embodiment, build layer retainer 100 may also extend fromparticle containment walls 110. In further alternative embodiments,build layer retainer 100 may extend from any portion of component 24,particle containment walls 110 and component supports 108 in any mannerthat facilitates fabrication of component 24 by additive manufacturingsystem 10 as described herein.

In the exemplary embodiment, portions of outer surface 106 face asubstantially particle-free region 103 of build platform 38. Morespecifically, radially outermost profiles 126 of outer profile 122 facesubstantially particle-free region 103 and are fabricated by additivemanufacturing system 10 using the processes described herein. Inalternative embodiments, the entirety of outer profile 122 may facesubstantially particle-free region 103.

FIG. 7 is a section side schematic view of build platform 38 and analternative embodiment of component 24 (shown in FIG. 4). FIG. 8 is asection side schematic view of component 24 taken along line 5-5 (shownin FIG. 7). The embodiment shown in FIG. 7 is substantially identical tothe embodiment shown in FIGS. 4-6, except component 24 includescomponent supports 108 positioned along outer profile 122, particleretention cavities 202 that are surrounded by consolidated portions ofcomponent 24, component supports 108, and particle containment walls110, and outer profile 122 that faces substantially particle-free region103. In the exemplary embodiment, four component supports 108 extendalong outer surface 106 in the Z-direction from build platform 38 to topsurface plane 114. A component support 108 extends from build platform38 to an overhang 400 of component 24 within a particle retention cavity202. An angled portion 402 of component 24 extends through a particleretention cavity 202 to a particle containment wall 110 at an angledportion angle 404. In further alternative embodiments, componentsupports 108 and particle containment walls 110 may be arranged in anymanner and in any quantity that facilitates fabrication of component 24using additive manufacturing system 10 as described herein.

In the exemplary embodiment, component support 108 facilitatesconsolidation of particles 45 to form overhang 400. More specifically,build angles of between approximately zero degrees and forty-fivedegrees relative to build platform plane 39 may be facilitated by usingcomponent supports 108 to stabilize the portions of component 24 beingconsolidated from particles 45. In an alternative embodiment, componentsupport 108 may extend between any portion of component 24 to any otherportion of component 24. In further alternative embodiments, overhang400 may be fabricated while facing substantially particle-free region103.

In the exemplary embodiment, angled portion 402 of component 24 extendsthrough particle retention cavity 202 to particle containment wall 110at an angle of approximately forty-five degrees relative to buildplatform plane 39. In alternative embodiments, angled portion 402 mayextend at any angle between approximately ninety degrees and forty-fivedegrees relative to build platform plane 39 without requiring componentsupport 108 to be fabricated to support angled portion 402. In furtheralternative embodiments, angled portion 402 may face substantiallyparticle-free region 103 during fabrication of angled portion 402.

FIG. 8 is a flow chart illustrating a method 500 for fabricatingcomponent 24. Referring to FIGS. 1-8, method 500 includes depositing 502a plurality of particles 45 onto a build platform 38. Method 500 alsoincludes distributing 504 the plurality of particles 45 to form a buildlayer 44. Method 500 further includes operating 506 a consolidationdevice 14 to consolidate a first plurality 104 of particles 45 to form acomponent 24. Component 24 includes a top surface 102 spaced apart frombuild platform 38 and an outer surface 106. Outer surface 106 extendsbetween build platform 38 and top surface 102 and at least a portion ofouter surface 106 faces a substantially particle-free region 103 ofbuild platform 38.

The embodiments described herein include an additive manufacturingsystem including at least one consolidation device configured to directat least one energy beam to generate a melt pool in a layer ofparticles, a build platform, and a component formed on the buildplatform. The component includes a top surface spaced apart from thebuild platform and an outer surface. The outer surface extends betweenthe build platform and the top surface, and at least a portion of theouter surface faces a substantially particle-free region of the buildplatform. In some embodiments, a build layer retainer is configured toretain at least a portion of the build layer along the top surface. Theadditive manufacturing system and the configuration of the componentfacilitates improving additively manufacturing components withoutsurrounding an outer face of the component with particles to facilitateimproving the quality of an additively manufacturing component andreducing the cost to additively manufacture the component.

An exemplary technical effect of the methods, systems, and apparatusdescribed herein includes at least one of: a) improving coverage of acomponent with particulate matter during the recoating process, b)reducing the amount of particulate matter required for additivelymanufacturing a component, c) improving dimensional consistency of acomponent, d) improving a surface finish of a component, and e) reducingthe cost of additively manufacturing a component.

Exemplary embodiments of additive manufacturing systems and componentsconfigured to facilitate fabrication of components having at least aportion of an outer face exposed to a substantially particle-free regionof the additive manufacturing system are described above in detail. Theadditive manufacturing systems and components, and methods of using andmanufacturing such systems are not limited to the specific embodimentsdescribed herein, but rather, components of systems and/or steps of themethods may be utilized independently and separately from othercomponents and/or steps described herein. For example, the methods mayalso be used in combination with other additive manufacturing systems,and are not limited to practice with only the additive manufacturingsystems, and methods as described herein. Rather, the exemplaryembodiment can be implemented and utilized in connection with many otherelectronic systems.

Although specific features of various embodiments of the disclosure maybe shown in some drawings and not in others, this is for convenienceonly. In accordance with the principles of the disclosure, any featureof a drawing may be referenced and/or claimed in combination with anyfeature of any other drawing.

This written description uses examples to disclose the embodiments,including the best mode, and also to enable any person skilled in theart to practice the embodiments, including making and using any devicesor systems and performing any incorporated methods. The patentable scopeof the disclosure is defined by the claims, and may include otherexamples that occur to those skilled in the art. Such other examples areintended to be within the scope of the claims if they have structuralelements that do not differ from the literal language of the claims, orif they include equivalent structural elements with insubstantialdifferences from the literal language of the claims.

What is claimed is:
 1. A method of fabricating a component, said methodcomprising: depositing particles onto a build platform; distributing thedeposited particles to form an initial build layer; operating at leastone consolidation device to consolidate at least a portion of thedeposited particles to form an initial layer of the component, whereinthe consolidation device comprises a laser device and a scanning device;repeating the steps of depositing particles, distributing the depositedparticles, and operating the at least one consolidation device to format least a portion of the component, the at least a portion of thecomponent including the initial build layer and at least one subsequentbuild layer, the at least a portion of the component including an outersurface defining an outer perimeter of the component, wherein at least aportion of the outer surface faces a substantially particle-free regionof the build platform, wherein forming each subsequent build layer ofthe at least one subsequent build layer comprises: depositing topsurface particles on the initial build layer or a previous layer of theat least a portion of the component; distributing the top surfaceparticles to form a top surface build layer; and operating the at leastone consolidation device to consolidate a first plurality of the topsurface particles along a scan path to form a top surface of thesubsequent build layer of the component and a build layer retainer ofthe subsequent build layer, the top surface spaced apart the buildplatform such that the outer surface extends between the build platformand the top surface, the build layer retainer extending from at least aportion of the top surface and around the outer perimeter, wherein thebuild layer retainer is configured to retain at least a portion of thetop surface build layer along the top surface; and operating the atleast one consolidation device to consolidate at least a portion of thedeposited particles, a second plurality of the top surface particles, orboth along a scan path to form at least one particle containment wall.2. The method in accordance with claim 1, wherein operating the at leastone consolidation device further includes directing a laser beam fromthe laser device to be incident on the first plurality of the topsurface particles along the scan path at a consolidation angle ofbetween zero degrees and ninety degrees relative to a plane defined bythe top surface of the component.
 3. The method in accordance with claim2, wherein the laser beam is directed to be incident on the firstplurality of top surface particles along the scan path at aconsolidation angle of between seventy-five degrees and ninety degrees.4. The method in accordance with claim 2, wherein the consolidationdevice is positioned to direct the laser beam to be incident on thecomponent from a position overlying the component.
 5. The method inaccordance with claim 2, wherein the at least one consolidation deviceis positioned to direct the laser beam to be incident on the componentfrom a position overlying the substantially particle-free region.
 6. Themethod in accordance with claim 1, further comprising: operating the atleast one consolidation device to direct a laser beam from the laserdevice to be incident on the outer surface at a consolidation angle ofbetween zero degrees and ninety degrees relative to a plane defined bythe top surface of the component.
 7. The method in accordance with claim1, wherein the build layer retainer extends from the at least a portionof the top surface at an angle of between ninety degrees and forty-fivedegrees relative to a plane defined by the build platform.
 8. The methodin accordance with claim 1, wherein operating the at least oneconsolidation device to form at least one particle containment wallincludes forming the at least one particle containment wall, wherein anouter profile of at least a portion of the at least one particlecontainment wall is continuous with an outer profile of at least aportion of the outer surface.
 9. The method in accordance with claim 1,further comprising: operating the at least one consolidation device toconsolidate a third plurality of the top surface particles, at least aportion of the deposited particles, or both along a scan path to form atleast one component support, wherein the at least one component supportis coupled to the component within at least one particle retentioncavity and is configured to support at least a portion of the component.10. The method in accordance with claim 1, further comprising: operatingthe at least one consolidation device to consolidate a third pluralitythe top surface particles, at least a portion of the depositedparticles, or both along a scan path to form at least one componentsupport, wherein the at least one component support is coupled to theouter surface of the component and is configured to support at least aportion of the component.
 11. The method in accordance with claim 10,wherein operating the at least one consolidation device to form at leastone component support includes forming the at least one componentsupport such that the at least one component support extends between afirst portion of the component and a second portion of the component.12. A method of fabricating a component, said method comprising:depositing particles onto a build platform; distributing the depositedparticles to form an initial build layer; operating at least oneconsolidation device to consolidate at least a portion of the depositedparticles to form an initial layer of the component, wherein theconsolidation device comprises a laser device and a scanning device; andrepeating the steps of depositing particles, distributing the depositedparticles, and operating the at least one consolidation device to format least a portion of the component, the at least a portion of thecomponent including the initial build layer and at least one subsequentbuild layer, the at least a portion of the component including an outersurface defining an outer perimeter of the component, wherein at least aportion of the outer surface faces a substantially particle-free regionof the build platform, wherein forming each subsequent build layer ofthe at least one subsequent build layer comprises: depositing topsurface particles on the initial build layer or a previous layer of theat least a portion of the component; distributing the top surfaceparticles to form a top surface build layer; and operating the at leastone consolidation device to consolidate a first plurality of the topsurface particles along a scan path to form a top surface of thesubsequent build layer of the component and a build layer retainer ofthe subsequent build layer, the top surface spaced apart the buildplatform such that the outer surface extends between the build platformand the top surface, wherein the build layer retainer is configured toretain at least a portion of the top surface build layer along the topsurface.
 13. The method in accordance with claim 12, wherein operatingthe at least one consolidation device further includes directing a laserbeam from the laser device to be incident on the first plurality of thetop surface particles along the scan path at a consolidation angle ofbetween zero degrees and ninety degrees relative to a plane defined bythe top surface of the component.
 14. The method in accordance withclaim 13, wherein the laser beam is directed to be incident on the firstplurality of the top surface particles along the scan path at aconsolidation angle of between seventy-five degrees and ninety degrees.15. The method in accordance with claim 12, further comprising:operating the at least one consolidation device to direct a laser beamfrom the laser device to be incident on the outer surface at aconsolidation angle of between zero degrees and ninety degrees relativeto a plane defined by the top surface of the component.
 16. The methodin accordance with claim 12, wherein the build layer retainer extendsfrom the at least a portion of the top surface at an angle of betweenninety degrees and forty-five degrees relative to a plane defined by thebuild platform.
 17. The method in accordance with claim 12, furthercomprising: operating the at least one consolidation device toconsolidate a second plurality of the top surface particles, at least aportion of the deposited particles, or both along a scan path to form atleast one component support configured to support at least a portion ofthe component.
 18. A method of fabricating a component, said methodcomprising: depositing particles onto a build platform; distributing thedeposited particles to form an initial build layer; operating at leastone consolidation device to consolidate at least a portion of thedeposited particles to form an initial layer of the component, whereinthe consolidation device comprises a laser device and a scanning device;repeating the steps of depositing particles, distributing the depositedparticles, and operating the at least one consolidation device to format least a portion of the component, the at least a portion of thecomponent including the initial build layer and at least one subsequentbuild layer, the at least a portion of the component including an outersurface defining an outer perimeter of the component, wherein at least aportion of the outer surface faces a substantially particle-free regionof the build platform, wherein forming each subsequent build layer ofthe at least one subsequent build layer comprises: depositing topsurface particles on the initial build layer or a previous layer of theat least a portion of the component; distributing the top surfaceparticles to form a top surface build layer; operating the at least oneconsolidation device to consolidate a first plurality of the top surfaceparticles along a scan path to form a top surface of the subsequentbuild layer of the component, the top surface spaced apart the buildplatform such that the outer surface extends between the build platformand the top surface; and operating the at least one consolidation deviceto consolidate at least a portion of the deposited particles, a secondplurality of the top surface particles, or both along a scan path toform at least one particle containment wall, wherein the at least oneparticle containment wall is coupled to the outer surface of thecomponent and configured to retain a plurality of particles within atleast one particle retention cavity between the at least one particlecontainment wall and at least a portion of the outer surface.
 19. Themethod in accordance with claim 18, wherein operating the at least oneconsolidation device to form at least one particle containment wallincludes forming the at least one particle containment wall, wherein anouter profile of at least a portion of the at least one particlecontainment wall is continuous with an outer profile of at least aportion of the outer surface.
 20. The method in accordance with claim18, further comprising: operating the at least one consolidation deviceto consolidate a third plurality of the top surface particles, at leasta portion of the deposited particles, or both along a scan path to format least one component support, wherein the at least one componentsupport is coupled to the component within the at least one particleretention cavity and is configured to support at least a portion of thecomponent.